ELPEPCB® Printed Circuit Coatings
The complete range of printed circuit coatings which fulfil highest demands in pcb manufacturing
ELPEPCB® Etch resists, plating resists and Elpemer® photoresists
For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness
Elpemer® photoresists
Excellent resolution, capable of representing ultra-fine traces < 50 µm; very low exposure energy; quick to dry; for all standard application processes; strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution
Thermal curing etch and plating resists
High-definition application by screen printing
UV curing etch and plating resists
High-definition application by screen printing, alkaline-strippable
ELPEPCB® Solder resists
Enable simultaneous “complete soldering” and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion
Photoimageable Elpemer® solder resists
Excellent resolution, capable of representing finest structures (ink dams), for all standard application processes, UL approvals in acc. with UL File No. E80315
Thermal curing solder resists
High-definition application by screen printing, UL approvals in acc. with UL File No. E80315
UV curing solder resists
High-definition application by screen printing, for “print and etch”, UL approvals in acc. with UL File No. E80315
ELPEPCB® Peelable solder masks
For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process
SD 2950 series
- For leaded or lead-free wave and reflow soldering and Hot-Air Levelling, some versions allow multiple soldering
- for printing over carbon-conductive ink
- peelable from plated-through holes
- suitable as masks in electroplating and
- ther metallisation processes
- unlimited pot/processing life, solvent-free
- recommended for the partial covering of assembled PCBs untergoing wave soldering: Peelable solder masks of the series PSM 13.990
- auxiliary products recommended: Cleaning agents R 5899, R 5821 and R 5817⇗
ELPEPCB® Plugging Pastes
Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing
SD 2361 series
- 100% solids content means virtually no volume shrinkage
- 1-pack system
- thixotropic adjustment for larger drill holes (approx. 0.5-1 mm)
- auxiliary products recommended: Anti-static spray HP 5500⇗, cleaning agents R 5899, R 5821 and R 5817⇗
Elpemer® VF 2467 DG
- Photoimageable plugging paste
- basically compatible with Elpemer® 2467 solder resist series
- aqueous-alkaline developable
- auxiliary products recommended: Screen opener HP 5200⇗, anti-static spray HP 5500⇗, special stripper HP 5710⇗, cleaning agents R 5899, R 5821 and R 5817⇗, defoamant HP 5911⇗
SD 2768 NB
- High solids content means low volume shrinkage
- for via-in-pad applications, no bleeding on gold or other metal surfaces
- auxiliary products recommended: Screen opener HP 5200⇗, anti-static spray HP 5500⇗, cleaning agents R 5899, R 5821 and R 5817⇗
Elpemer® VF 2469 SM-HF
- Photoimageable plugging paste
- basically compatible with the Elpemer® 2469 SM-HF solder resist series
- developable in carbitol or butyl carbitol
- halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
- auxiliary products recommended: Screen opener HP 5200⇗, anti-static spray HP 5500⇗, special stripper HP 5710⇗, cleaning agents R 5899, R 5821 and R 5817⇗
ELPEPCB® Via Filler
Bubble-free, smooth hole filling/insulation layers in HDI/SBU technology, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315
PP 2794 TG150
- application by means of screen and stencil printing or vacuum plugging
- glass transition temperature Tg = 150 °C
- long shelf life: 6 months
- auxiliary products recommended: Screen opener HP 5200⇗, anti-static spray HP 5500⇗, cleaning agents R 5899, R 5821 and R 5817⇗
PP 2795 series
- Application by screen and stencil printing, vacuum plugging and roller coating
- higher aspect ratios possible with high-viscosity adjustment
- listed in NASA specification D-8202
- long shelf life: 6 months
- auxiliary products recommended: Screen opener HP 5200⇗, anti-static spray HP 5500⇗, cleaning agents R 5899, R 5821 and R 5817⇗
ELPEPCB® Marking inks
Exceptional covering power, very good adhesion, soldering resistant, high solids content
Photoimageable Elpemer® marking inks
Blanket application by screen printing, especially suitable for pilot and low-volume series’ as no complex screen stencil required, capable of representing finest details
Thermal curing marking inks
High-definition application by screen printing
UV curing marking inks
High-definition application by screen printing
ELPEPCB® Carbon-conductive inks
to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors.
High-definition application by screen printing, very good adhesion to flexible base material, thus also suitable for “static flex” applications, excellent mechanical resistance, resistant to Hot-Air Levelling
ELPEPCB® Thermal transfer pastes
Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating
Heatsink pastes
for heat transfer and heat dissipation
Thermal interface paste
applied as Thermal Interface Material (TIM) between the printed circuit board and the heatsink or heat-dissipating casings