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ELPEPCB® printed circuit coatings
ELPEPCB® printed circuit coatings
ELPEPCB® printed circuit coatings

Products & Service: ELPEPCB® printed circuit coatings

The complete range of printed circuit coatings which fulfil highest demands in pcb manufacturing

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ELPEPCB® Etch resists, plating resists and Elpemer® photoresists
ELPEPCB® Etch resists, plating resists and Elpemer® photoresists

For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness

ELPEPCB® Etch resists, plating resists and Elpemer® photoresists

For the creation of fine and ultra-fine trace images on inner and outer layers; excellent adhesion and high surface hardness

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Elpemer® photoresists

Excellent resolution, capable of representing ultra-fine traces < 50 µm; very low exposure energy; quick to dry; for all standard application processes; strippable in filterable flakes, promoting reduced waste water contamination and longer standing time of the stripper solution

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RC 2054 HR
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RC 2054 HR
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SD 2054
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SD 2054
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Thermal curing etch and plating resists

High-definition application by screen printing

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SD 2052 AL series
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SD 2052 AL series
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SD 2149 SIT-HS
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SD 2149 SIT-HS
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Aurosit 2149 series
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Aurosit 2149 series
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SD 2154 E
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SD 2154 E
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UV curing etch and plating resists

High-definition application by screen printing, alkaline-strippable

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SD 2050 UV
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SD 2050 UV
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SD 2059 UV-AL-T
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SD 2059 UV-AL-T
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ELPEPCB® Solder resists
ELPEPCB® Solder resists

Enable simultaneous "complete soldering" and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion

ELPEPCB® Solder resists

Enable simultaneous "complete soldering" and selective soldering, compatible with lead-free soldering processes, for rigid, flex-rigid and flexible pcbs, excellent adhesion

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Photoimageable Elpemer® solder resists

Excellent resolution, capable of representing finest structures (ink dams), for all standard application processes, UL approvals in acc. with UL File No. E80315

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SD 2463 FLEX-HF series
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SD 2463 FLEX-HF series
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2467 series
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2467 series
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2469 SM-HF series
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2469 SM-HF series
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2491 TSW series
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2491 TSW series
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Thermal curing solder resists

High-definition application by screen printing, UL approvals in acc. with UL File No. E80315

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SD 2444 NB-M
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SD 2444 NB-M
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SD 2446 / SD 2496 TSW
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SD 2446 / SD 2496 TSW
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SD 2462 NB / SD 2462 NB-M series
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SD 2462 NB / SD 2462 NB-M series
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UV curing solder resists

High-definition application by screen printing, for "print and etch", UL approvals in acc. with UL File No. E80315

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SD 2368 UV series
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SD 2368 UV series
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SD 2460/201 UV-FLEX series
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SD 2460/201 UV-FLEX series
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ELPEPCB® Peelable solder masks
ELPEPCB® Peelable solder masks

For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process

ELPEPCB® Peelable solder masks

For the partial masking of pcbs as protection from direct contact with solder or as protection in electroplating processes, simple/high-definition application by screen printing, very high elasticity and tear resistance, easy to remove before and/or after the soldering process

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SD 2950 series
  • For leaded or lead-free wave and reflow soldering and Hot-Air Levelling, some versions allow multiple soldering
  • For printing over carbon-conductive ink
  • Peelable from plated-through holes
  • Suitable as masks in electroplating and other metallisation processes
  • Unlimited pot/processing life, solvent-free
  • Recommended for the partial covering of assembled PCBs untergoing wave soldering: Peelable Solder Masks of the series PSM 13.990
  • Recommended auxiliary products: Cleaning agents R 5899, R 5821 and R 5817
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SD 2950 series
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  • For leaded or lead-free wave and reflow soldering and Hot-Air Levelling, some versions allow multiple soldering
  • For printing over carbon-conductive ink
  • Peelable from plated-through holes
  • Suitable as masks in electroplating and other metallisation processes
  • Unlimited pot/processing life, solvent-free
  • Recommended for the partial covering of assembled PCBs untergoing wave soldering: Peelable Solder Masks of the series PSM 13.990
  • Recommended auxiliary products: Cleaning agents R 5899, R 5821 and R 5817
 
ELPEPCB® Via hole fillers
ELPEPCB® Via hole fillers

Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing

ELPEPCB® Via hole fillers

Securely seal via holes for vacuum adaptation during incircuit testing, prevent solder from seeping to the component side and fluxers from settling in drill holes, UL approvals in acc. with UL File No. E80315, application by screen printing

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SD 2361 series
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SD 2361 series
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Elpemer® VF 2467 DG
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Elpemer® VF 2467 DG
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SD 2768 NB
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SD 2768 NB
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Elpemer® VF 2469 SM-HF
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Elpemer® VF 2469 SM-HF
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ELPEPCB® Plugging pastes
ELPEPCB® Plugging pastes

Bubble-free, smooth hole plugs/insulation layers in HDI/SBU technology, application by screen and stencil printing and vacuum screen printing, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315

ELPEPCB® Plugging pastes

Bubble-free, smooth hole plugs/insulation layers in HDI/SBU technology, application by screen and stencil printing and vacuum screen printing, excellent metallisability, low thermal expansion coefficient, no cracking or delamination of the applied metallisation, UL approvals in acc. with UL File No. E80315

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PP 2795 series
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PP 2795 series
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ELPEPCB® Marking inks
ELPEPCB® Marking inks

Exceptional covering power, very good adhesion, soldering resistant, high solids content

ELPEPCB® Marking inks

Exceptional covering power, very good adhesion, soldering resistant, high solids content

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Photoimageable Elpemer® marking inks

Blanket application by screen printing, especially suitable for pilot and low-volume series' as no complex screen stencil required, capable of representing finest details

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SD 2691 TSW
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SD 2691 TSW
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SD 2618 / SD 2698
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SD 2618 / SD 2698
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Thermal curing marking inks

High-definition application by screen printing

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SD 2696 TSW
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SD 2696 TSW
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SD 2692 T series
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SD 2692 T series
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SD 2617 series
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SD 2617 series
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UV curing marking inks

High-definition application by screen printing

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SD 2513 UV series
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SD 2513 UV series
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ELPEPCB® Carbon-conductive inks
ELPEPCB® Carbon-conductive inks

to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors

ELPEPCB® Carbon-conductive inks

to substitute gold on contact points, also suitable for cross-over technology and for generating printed resistors

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Carbon-conductive inks

High-definition application by screen printing, very good adhesion to flexible base material, thus also suitable for "static flex" applications, excellent mechanical resistance, resistant to Hot-Air Levelling

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SD 2842 HAL
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SD 2842 HAL
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SD 2843 HAL
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SD 2843 HAL
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ELPEPCB® Thick film fillers
ELPEPCB® Thick film fillers

Fill insulation channels in thick copper technology (e.g. 400 µm technology) by means of screen or stencil printing, solvent-free, very good soldering resistance also in lead-free soldering processes

ELPEPCB® Thick film fillers

Fill insulation channels in thick copper technology (e.g. 400 µm technology) by means of screen or stencil printing, solvent-free, very good soldering resistance also in lead-free soldering processes

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DSF 2706 UV
  • UV curing 2-pack system
  • UL approval in acc. with UL 94, UL File No. E80315
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • For use on outer layers
  • System component in thick copper technology in combination with the 2-pack solder resist SD 2462 NB-M as "top coat"
  • Recommended auxiliary products: Cleaning agents R 5899, R 5821 and R 5817
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DSF 2706 UV
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  • UV curing 2-pack system
  • UL approval in acc. with UL 94, UL File No. E80315
  • Halogen-free in acc. with JPCA-ES01-2003 / IEC 61249-2-21
  • For use on outer layers
  • System component in thick copper technology in combination with the 2-pack solder resist SD 2462 NB-M as "top coat"
  • Recommended auxiliary products: Cleaning agents R 5899, R 5821 and R 5817
DSF 2793
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DSF 2793
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ELPEPCB® Thermal transfer pastes
ELPEPCB® Thermal transfer pastes

Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating

ELPEPCB® Thermal transfer pastes

Highly thermally conductive systems for the thermal management of pcbs/pcb assemblies, cost-effective alternative to conventional glued heatsinks, flexible design of different heatsink geometries with existing screen printing technology, electrically insulating

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Heatsink pastes

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HSP 2740 / HSP 2741
  • 1-pack systems with 100% solids content
  • HSP 2740: Excellent printing properties, silk-mat surface and better chemical resistance
  • HSP 2741: Higher flexibility, thus less impact on the evenness of the pcb; UL approval in acc. with UL File No. E80315
  • Recommended auxiliary products: Cleaning agents R 5899, R 5821 and R 5817
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HSP 2740 / HSP 2741
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  • 1-pack systems with 100% solids content
  • HSP 2740: Excellent printing properties, silk-mat surface and better chemical resistance
  • HSP 2741: Higher flexibility, thus less impact on the evenness of the pcb; UL approval in acc. with UL File No. E80315
  • Recommended auxiliary products: Cleaning agents R 5899, R 5821 and R 5817

Thermal interface paste

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TIP 2792
  • 1-pack system with 100% solids content
  • is applied as Thermal Interface Material (TIM) between the printed circuit board and the heatsink or heat-dissipating casings for a reliable thermal connection
  • for thermo-mechanical decoupling
  • recommended auxiliary product: Cleaning agent R 5817
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TIP 2792
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  • 1-pack system with 100% solids content
  • is applied as Thermal Interface Material (TIM) between the printed circuit board and the heatsink or heat-dissipating casings for a reliable thermal connection
  • for thermo-mechanical decoupling
  • recommended auxiliary product: Cleaning agent R 5817
 
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